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Jul 17, 2023
The polyimide and inorganic materials (especially SiO2 substrate) can be connected by Covalent bond to form a structural composite, thus increasing the bonding reliability and stability. The interaction in this system can be seen as a gradual process: the formation of citrate salts between amines attached to the surface and polyamide esters; Heating to form a diamide attached to the surface; Thermal cyclization forms Imide attached to the surface. This interface composite material is relatively stable under nitrogen until (370 ± 10) ° C, but exceeding 400 ° C can cause structural changes and damage the adhesion between materials.
Due to the hydrolysable group at the end of silane terminated polyimide, the shin group formed by hydrolysis can be dehydrated under appropriate conditions, making the material form a cross-linked structure. According to this principle, p-aminophenyl Trimethoxysilane (APTS), diphenyl diamine CODA) and diphenyl tyrenedianhydride COD PA) was copolymerized to prepare polyamide ester (PAA) containing silicon group at the end, and then dehydrated and cyclized to form a polyimide/polyssesquioxane like film (Pl/PSSQ Like). It was found that reducing the polyimide block chain length increased the rigidity of the crosslinked network, which could increase its storage modulus, bending modulus and glass transition temperature (Tg), and reduce the elongation and the strength of a relaxation damping peak. However, due to the introduction of more free volume, the force between the polyimide segments decreases, while also improving the dielectric and hydrophobicity of the membrane.
The Silicon monoxide/polyimide hybrid can be decomposed by adding water to the polyimide capped with the Silicon alkoxide ester. And obtained through condensation and crosslinking. Using amino terminated polytetrahydrofuran as diamine. Silicon dioxide hybrid polyimide elastomer Silicon dioxide/polyimide hybrid elastomer polyimide elastomer with high elastic modulus and tensile strength, significantly improved heat resistance, but the specific structure is unknown. Polyimide/silica hybrid membrane was prepared by mixing PyreML and Skybond 703, two polyamide acid precursors, tetraethyl orthosilicate and coupling agent.
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